Invention:
This invention is a novel device that answers challenges of increased robustness and faster acquisition time. This new device has no moving mechanical parts, mounts directly onto the focal plane imaging array, and acquires both the spectral and spatial information at once. Thus, this new device is significantly more robust than its predecessors in the field, and it offers a true snapshot capability. Its form factor is also significantly reduced with respect to its predecessors. Furthermore, due to the device’s passive design, it does not require any power to operate beyond what is needed for the image capture and signal processing hardware.
Background:
Today’s applications of remote sensing demand information of increasing sophistication. In particular, there is a need to obtain detailed spatial and spectral information over a short period of time (e.g., to counter motion blur). Though a number of imaging spectrometer technologies have emerged in recent years, they are often technologically complex and lack the snapshot capability, which makes them susceptible to mechanical stress, vibration, and motion. Therefore, there is a need to develop imaging spectrometer hardware that is mechanically robust and features snapshot image acquisition.
Advantages:
- Lack of moving parts makes the device mechanically robust
- Small footprint – the device can be mounted directly onto the focal plane array
- The device is passive, hence it does not require extra power for operation
Applications:
- Remote sensing
- Environmental monitoring
- Machine vision
