Systems and Fabrication Methods for Resistor Designs Through Printing

Case ID:
UA26-100
Invention:

This invention involves a fabrication method for directly embedding customized resistors into a 3D printed object. This entails using multiple low conducive filaments in order to flexibly customize the resistance of a trace, that acts as a resistor, printed through the combinations of the various low and medium range conductive filaments. 

Background: 
Currently, existing technology-based resistor embedding systems use high-ranging conductive filaments in order to 3D print or fabricate. These methods require a long trace to achieve a particular resistance and are controlled solely by the length. This dependence on long conductive traces makes existing systems unsuitable for compact or small-volume printed objects. The new capability of this invention will advance printed electronics by utilizing multiple ranges of lower-conductivity filaments to enable the integration of compact resistors directly into electronic objects.


Applications: 

  • Resistors
  • 3D printing
  • Embedded systems
  • Conductive filaments


Advantages: 

  • More flexible printing and fabrication
  • Multiple touchpoints for a small 3D printed object
  • Better control of resistance
  • Allows printing of resistors with limited volume
  • Enables compact resistor embedding
Patent Information:
Contact For More Information:
Jonathan Larson
Senior Licensing Manager, College of Science
The University of Arizona
jonathanlarson@arizona.edu
Lead Inventor(s):
Suyun Bae
Takanori Fujiwara
Keywords: