Invention:
The inventors have developed an optical system, laser spot position determination process, and calibration process for deterministically figuring thin mirrors by creating stress inside the glass substrate (or other material transparent to the laser beam wavelength) using an ultrashort pulsed (USP) laser. This process is especially useful for low spatial frequency correction of optical components with high aspect ratio (lateral size to thickness ratio).
Background:
Current solutions focus on elementary volumes and elements of an optical substrate or wafer. In contrast, this technology allows for an arbitrary deformation map of the entire substrate, determining deviations and deformations of elementary volumes, simplifying the decision-making process, and providing flexibility to optimize laser pulse positions for machine efficiency or process throughput. This technology is an all-in-one solution that allows for the freeform surface height correction across multiple markets that traditional grinding and polishing fail to address. Telescope mirrors, semiconductor optical components, and head-mounted displays are all markets where this device can excel.
Applications:
- All-in-one
- Thin mirror manufacturing
- Semiconductors
- Head-mounted displays (VR)
Advantages:
