Scalable Grayscale Lithography on Any Material through Reactive Ion Etching

This invention is a new approach to grayscale lithography, enabling the direct fabrication of 3D features on a variety of materials without the need for photoresists. By leveraging two effects during reactive ion etching (RIE), the process provides precise control over the depth and profile of etched features, making it highly versatile for applications on optical and other substrates. Unlike conventional lithographic methods, which are often material-limited and less scalable, this technology expands the possibilities for etching complex structures on a broader range of surfaces. Key benefits of this approach include its flexibility to be applied on various materials beyond traditional photoresists, making it suitable for both optical materials and general substrates. Additionally, the process is highly scalable and provides fine control over the etch depth through the manipulation of feature size, allowing for accurate and intricate 3D structures. This makes it an ideal solution for industries requiring precise depth modulation across different surfaces.

Background: 
Current grayscale lithography methods such as grayscale photolithography and two-photon polymerization (TPP) are often restricted to specific materials like photoresists and lack scalability for use on a wider range of substrates, such as optical materials. These methods also struggle with achieving high scalability and precise depth control for more complex, 3D structures. This invention overcomes those limitations, providing a versatile solution with more flexibility and precision across different materials and applications.

Applications:

• Grayscale lithography
• Microelectronics
• Biomedical devices
• MEMS (Micro-Electro-Mechanical Systems)

Advantages:

• Can be applied to a wide range of materials, not just photoresists
• Scalable for both micro- and macro-scale applications
• Precise control over etch depth for intricate 3D structures
• Reduces the need for additional processing steps, saving time and cost