Invention:
This invention is a new lithographic technique for the enhancement of resolution using a multi-layer photoresist system. This new method avoids the need for substrate removal and allows for sequential patterning during multiple exposure processes. Without substrate removal, additional steps and realignment are unnecessary, thus expediting the process.
Background:
Traditional multi-step lithography processes to improve resolution often require multiple exposures with many intermediate development and realignment steps. These highly sensitive processes contribute to a lengthy and complicated fabrication process with high risks of error possible. This new technique allows for multiple photoresist layers to eliminate the need for continuing realignment for a simplified and more efficient patterning process.
Applications:
- Lithography / photolithography
- CMOS fabrication
Advantages:
- Eliminates need for substrate removal
- Increased alignment efficiency
- Simplified process
- Enhanced resolution
