Invention:
This technology introduces a flexible glass-based optical interconnect solution for photonic integrated circuits (PICs). It leverages a carefully designed array of high index and low index materials to make an optical connection that optimizes light coupling and reduces scattering and propagation loss. The method provides a solution to replace traditional electronic interconnect with a scalable, low loss, inexpensive optical connection with high yield and bandwidth. The method withstands temperatures above 200°C, making it suitable for advanced packaging and high-performance applications. Using femtosecond laser direct writing (FLDW), the technology provides precise waveguide fabrication within a flexible glass slab, allowing for optimal light coupling and minimal propagation loss.
Background:
Existing optical interconnect solutions, such as photonic wire bonding, optical fiber coupling, and prefabricated waveguides, struggle with high alignment precision requirements, limited scalability, and sensitivity to temperature variations. Many current techniques rely on polymer-based waveguides, which degrade under high temperatures and can cause instability in packaging. This invention addresses these issues by using a flexible glass slab that supports both butt and adiabatic coupling, allowing real-time adjustments for variations in PIC fabrication while maintaining high yield and performance.
Applications:
- Photonic integrated circuits (PICs)
- Optical printed circuit boards (OPCBs)
- Fiber optic communication systems
- High-temperature optical packaging solutions
Advantages:
- Scalable and cost-effective
- High-temperature tolerance
- Higher manufacturing yield
- Optimized light coupling
- Reduced scattering and propagation loss
- Flexible and adaptable
