Using Back-End-of-the-Line Wires in CMOS Process as Metal-Optic Antennas to Enhance Nonlinear Processes for Imaging Applications
This invention repurposes existing metallic wires in the complementary metal-oxide semiconductor (CMOS) process to function as metal-optic antennas to strengthen the specificity and efficiency of biological photodetection imaging systems, such as two-photon absorption detectors and upconversion imaging devices. This new method avoids the incompatibility...
Published: 9/16/2024
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Inventor(s): Mohamed ElKabbash
Keywords(s):
Category(s): Technology Classifications > Imaging & Optics > Sensors and Detection > Remote Sensing, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > Communications & Networking > Antenna
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Continuous Amplitude and Phase Modulation Using Rotary MEMS with Patterned Photonic Crystals and Metasurfaces
This technology uses photonic crystals on rotary microelectromechanical systems (MEMS) to achieve continuous amplitude and phase modulations in digital micromirror devices (DMDs) and other spatial light modulators (SLMs). By incorporating guided mode resonance (GMR) in photonic crystals and utilizing anisotropic and geometric phase metasurfaces, the...
Published: 9/16/2024
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Inventor(s): Mohamed ElKabbash
Keywords(s):
Category(s): Technology Classifications > Imaging & Optics > Lens & System Design, Technology Classifications > Imaging & Optics > Materials & Fabrication, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology
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EUV-Compatible DMD Device Using Existing DMDs with Deposited EUV DBR Mirrors
This technology is a method of transforming standard digital micromirror devices (DMDs), which are compatible with visible and near-infrared light, into DMDs suitable for extreme ultraviolet (EUV) applications. This is done by depositing EUV-compatible mirrors onto each micromirror of a standard DMD. The resulting EUV-compatible DMD yields an efficient...
Published: 9/16/2024
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Inventor(s): Mohamed ElKabbash
Keywords(s):
Category(s): Technology Classifications > Imaging & Optics > Lens & System Design, Technology Classifications > Imaging & Optics > Materials & Fabrication, Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology
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On-Chip Magnetometer
This innovation is a Photonic Integrated Circuit (PIC)-based magnetometer that can be used to measure nano- and sub-nano-tesla magnetic fields. High-sensitivity magneto optic nanocomposite materials are used as optical device cladding and/or device materials to register a shift in light polarization due to Faraday rotation. Devices based on evanescent...
Published: 8/28/2024
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Inventor(s): Sasaan Showghi, Shelbi Jenkins
Keywords(s):
Category(s): Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Imaging & Optics > Sensors and Detection
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Graphene Based Diode for Infrared Heating and Detection
This technology is an infrared light emitting diode (LED) designed for radiative heating applications. It utilizes a novel design based on nanostructured stacks of graphene sheets. Due to its flexible and lightweight design, it is suitable for a wide range of radiative heating applications including in fabrics and plastic sheets. The structure can also...
Published: 8/8/2024
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Inventor(s): John Schaibley
Keywords(s):
Category(s): Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Electronics
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Restricted Area Printing by Ink Drawing (RAPID) for Solution-Processed Thin Films
Researchers at the University of Arizona have developed Restricted Area Printing by Ink Drawing (RAPID), a novel confined-volume printing technique for solution-processed thin films. This method utilizes confined plates to apply external stimuli, such as temperature and electric fields, allowing for precise control over the crystallization process during...
Published: 10/28/2024
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Inventor(s): Adam Printz, Matthew Dailey, Subham Dastidar
Keywords(s):
Category(s): Technology Classifications > Materials > Processing, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Semiconductors
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High-Throughput 3D Printing System
This invention is a high-throughput 3D printing system that employs a multi-head configuration, complemented by custom objectives designed for an expanded field of view (FOV). This approach uses a custom-designed microscope objective with expanded FOV for greater accuracy during production. The system results in a significant increase in 3D printing...
Published: 7/25/2024
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Inventor(s): Rongguang Liang, Zhihan Hong, Piaoran Ye
Keywords(s):
Category(s): Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Imaging & Optics > Materials & Fabrication
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Trapped particle classification in additive manufacturing
This technology is an improvement to a rapid design approach for designing nanophotonic devices. It is a method of optical positioning and linking (OPAL) using highly focused lasers (sometimes called “optical tweezers”) used for nanofabrication of molecules for devices, drugs, and other nano-metamaterials.
Combined with the previous optical...
Published: 3/10/2024
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Inventor(s): Euan Mcleod, Natalie Shultz
Keywords(s):
Category(s): Technology Classifications > Engineering & Physical Sciences > Photonics, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Imaging & Optics > Fiber Optics, Technology Classifications > Imaging & Optics > Lasers & Other Sources, Technology Classifications > Sensors & Controls > Biologic, Technology Classifications > Imaging & Optics > Telecommunications > Electro-Optic Devices
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Micro-Torsion Balance
This technology is a new ultra-sensitive torsion balance device small enough to fit on a microchip, that can be used to measure forces, gravity, or acceleration with a high degree of resolution.
Background:
A torsion balance measures torque by monitoring the rotation of a test mass suspended by from an elastic fiber (acting as a torsion spring). To...
Published: 4/3/2023
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Inventor(s): Aman Rajendra Agrawal, Dalziel Wilson, Jon Pratt, Stephan Schlamminger
Keywords(s):
Category(s): Technology Classifications > Imaging & Optics > Sensors and Detection > Remote Sensing, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology
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"Stick and Peel" Probe Properties of Perovskite Material Properties for Manufacturing Scale-Up and Quality Control
A “stick and peel” removable electrochemical probe is used for solvent-free characterization of semiconductor films or optoelectronic devices. The invention may be used to analyze electronic materials such as a metal halide perovskite, an organic semiconductor, a nanocrystalline (quantum dot) thin film, metal oxides, a material blend or...
Published: 3/12/2024
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Inventor(s): Michel De Keersmaecker, Erin Ratcliff, Neal Armstrong
Keywords(s):
Category(s): Technology Classifications > Energy, Cleantech & Environmental > Energy Collection, Storage & Battery, Technology Classifications > Energy, Cleantech & Environmental > Fuel Cells, Technology Classifications > Energy, Cleantech & Environmental > Manufacturing, Technology Classifications > Energy, Cleantech & Environmental > Low Carbon, Technology Classifications > Energy, Cleantech & Environmental > Renewable Energy > Solar/Photovoltaic, Technology Classifications > Engineering & Physical Sciences > MEMS & Nanotechnology, Technology Classifications > Engineering & Physical Sciences > Semiconductors, Technology Classifications > Imaging & Optics > Materials & Fabrication, Technology Classifications > Imaging & Optics > Sensors and Detection, Technology Classifications > Imaging & Optics > Sensors and Detection > Inspection, Technology Classifications > Materials > Chemicals, Technology Classifications > Materials > Nanomaterials, Technology Classifications > Materials > Processing, Technology Classifications > Sensors & Controls
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