Fabrication of Polymer Waveguide Interconnect Between Chips with a Gap/Step using Flexible Polymer Dry Film Resist for Photonic Integrated Circuits (PICs)

This technology describes a new method to form a stable physical barrier between chips within a photonic integrated circuit (PIC), utilizing polymer dry film negative resist. The technique enables the  fabrication of polymer waveguide interconnects.

Background:

The current standard of applying polymer dry film resists works well for a single chip However, when there is a gap or step between two chips, the resist can break at the gap/step upon removing the backing.

Applications:

• Fabrication of polymer waveguide interconnects
• Potential for use in creating PICs

Advantages:

• Flexible
• Provides a physical barrier for waveguides
• Keep dry film intact

Status: issued U.S. patent #11,275,208