High-Throughput 3D Printing System

Case ID:
UA24-031
Invention:

This invention is a high-throughput 3D printing system that employs a multi-head configuration, complemented by custom objectives designed for an expanded field of view (FOV). This approach uses a custom-designed microscope objective with expanded FOV for greater accuracy during production. The system results in a significant increase in 3D printing throughput, enabling greater production efficiency and speed, improving the current state of 3D nano-printing technology (two-photon polymerization, or TPP). 

Background: 
The current two-photon polymerization (TPP) printing method has a notable drawback: its relatively low throughput, primarily due to the microscope objective's limited field of view (FOV), which is typically less than 1mm. While stitching methods have been employed to print larger elements, they are not ideal for optical elements. This is because optical surfaces demand exceptional quality, and even minute variations at the transition regions between stitched areas can significantly degrade image quality. Furthermore, the restricted FOV of the objective lens hinders the potential of printing more than one element or system with the dimensions suitable for micro-optics using cutting-edge techniques.

Applications: 

  • Additive manufacturing
  • Industrial manufacturing
  • Automotive
  • Healthcare
  • Aerospace


Advantages: 

  • Greater production efficiency
  • Improved field of view 
  • Lower materials cost
  • Greater production speed
Patent Information:
Contact For More Information:
Richard Weite
Senior Licensing Manager, College of Optical Sciences
The University of Arizona
RichardW@tla.arizona.edu
Lead Inventor(s):
Rongguang Liang
Zhihan Hong
Piaoran Ye
Keywords: